Curiteva issued patent for 3D technology

HUNTSVILLE – Technology and medical device manufacturer Curiteva has been issued its third Utility Patent in support of Inspire 3D printed porous PEEK with HA^FUSE technology platform.

The patent comes on the heels of Curiteva receiving FDA clearance for the world’s first 3D printed, fully interconnected porous PEEK structure and limited commercial release of the product last month. Read more about that here on 256 Today.

As pioneers of the world’s first 3D printed interbody spinal implants, Curiteva said they still have two pending patent applications and plan to submit additional filings for their emerging platform.

On April 6, five weeks after receiving approval for commercial release, Curiteva conducted the first surgical procedure with the Inspire 3D Porous PEEK HA^FUSE Cervical Interbody System.

“Once we launch our PLIF, TLIF, Static and Standalone ALIF interbody devices in 2024, this will position Curiteva to disrupt the spine market with this new category of implants,” said Curiteva Executive Vice President Mark Mohlman.

Curiteva’s co-founder and Chief Technology Officer Eric Linder said years of development and innovation contributed to the groundbreaking new industry category which they are extending into lumbar interbody devices later this year.

“Establishing comprehensive market protection for our platform technology which encompasses manufacturing hardware, software, peripheral monitoring, device design and material composition, is a valuable and necessary proposition.”

Dr. Erik Erbe, chief scientific officer at Curiteva said the company will continue to invest in protecting differentiated and pioneering technology as they establish their proprietary Inspire commercial portfolio.

“The most recent patent further differentiates us from other porous and 3D printed implant designs and broadens the intellectual property estate around our novel technology.”

The company plans a full commercial launch of the Inspire Cervical System later this summer.